Q. Bipolar transistor

 

Symbol Names: NPN, PNP, NPN2, PNP2

 

Syntax: Qxxx Collector Base Emitter [Substrate Node]

+ model [area] [off] [IC=<Vbe, Vce>] [temp=<T>]

 

Example:

 

Q1 C B E MyNPNmodel

.model MyNPNmodel NPN(Bf=75)

 

Bipolar transistors require a model card to specify its characteristics. The model card keywords NPN and PNP indicate the polarity of the transistor.

 

The bipolar junction transistor model is an adaptation of the integral charge control model of Gummel and Poon. This modified Gummel-Poon model extends the original model to include several effects at high bias levels, quasi-saturation, and substrate conductivity. The model automatically simplifies to the Ebers-Moll model when certain parameters are not specified. The DC model is defined by the parameters Is, Bf, Nf, Ise, Ikf, and Ne which determine the forward current gain characteristics, Is, Br, Nr, Isc, Ikr, and Nc which determine the reverse current gain characteristics, and Vaf and Var which determine the output conductance for forward and reverse regions. Three ohmic resistances Rb, Rc and Re, are included, where Rb can be high current dependent. Base charge storage is modeled by forward and reverse transit times, Tf and Tr, the forward transit time Tf being bias dependent if desired; and nonlinear depletion layer capacitances, which are determined by Cje, Vje and Mje, for the B-E junction, Cjc, Vjc, and MJC for the B-C junction and Cjs, Vjs, and Mjs for the Collector- Substrate junction. The temperature dependence of the saturation current, Is, is determined by the energy gap, Eg, and the saturation-current temperature exponent, XTI. Additionally base current temperature dependence is modeled by the beta temperature exponent XTB in the new model. The values specified are assumed to have been measured at the temperature TNOM, which can be specified on the .OPTIONS control line or overridden by a specification on the .model line.

 

The BJT parameters used in the modified Gummel-Poon model are listed below.

 

Modified Gummel-Poon BJT Parameters

 

Name

Description

Units

Default

Is

Transport saturation current

A

1e-16

Bf

Ideal maximum forward beta

-

100

Nf

Forward current emission coefficient

-

1.

Vaf

Forward Early voltage

V

Infin.

Ikf

Corner for forward beta high current roll-off

A

Infin.

Ise

B-E leakage saturation current

A

0.

Ne

B-E leakage emission coefficient

-

1.5

Br

Ideal maximum reverse beta

-

1.

Nr

Reverse current emission coefficient

-

1.

Var

Reverse Early voltage

V

Infin.

Ikr

Corner for reverse beta high current roll-off

A

Infin.

Isc

B-C leakage saturation current

A

0

Nc

B-C leakage emission coefficient

-

2

Rb

Zero-bias base resistance

W

0

Irb

Current where base resistance falls halfway to its min value

A

Infin.

Rbm

Minimum base resistance at high currents

W

Rb

Re

Emitter resistance

W

0.

Rc

Collector resistance

W

0.

Cje

B-E zero-bias depletion capacitance

F

0.

Vje

B-E built-in potential

V

0.75

Mje

B-E junction exponential factor

-

0.33

Tf

Ideal forward transit time

sec

0.

Xtf

Coefficient for bias dependence of Tf

-

0.

Vtf

Voltage describing Vbc dependence of Tf

V

Infin.

Itf

High-current parameter for effect on Tf

A

0.

Ptf

Excess phase at freq=1/(Tf*2*PI)Hz

º

0.

Cjc

B-C zero-bias depletion capacitance

F

0.

Vjc

B-C built-in potential

V

0.75

Mjc

B-C junction exponential factor

-

0.33

Xcjc

Fraction of B-C depletion capacitance connected to internal base node

-

1.

Tr

Ideal reverse transit time

sec

0.

Cjs

Zero-bias collector-substrate capacitance

F

0.

Vjs

Substrate junction built-in potential

V

0.75

Mjs

Substrate junction exponential factor

-

0.

Xtb

Forward and reverse beta temperature exponent

-

0.

Eg

Energy gap for temperature effect on Is

eV

1.11

Xti

Temperature exponent for effect on Is

-

3.

Kf

Flicker-noise coefficient

-

0.

Af

Flicker-noise exponent

-

1.

Fc

Coefficient for forward-bias depletion capacitance formula

-

0.5

Tnom

Parameter measurement temperature

ºC

27

Cn

Quasi-saturation temperature coefficient for hole mobility

2.42 NPN

2.2 PNP

D

Quasi-saturation temperature coefficient for scattering-limited hole carrier velocity

.87 NPN

.52 PNP

Gamma

Epitaxial region doping factor

 

1e-11

Qco

Epitaxial region charge factor

Coul

0.

Quasimod

Quasi-saturation flag for temperature dependence

-

(not set)

Rco

Epitaxial region resistance

W

0.

Vg

Quasi-saturation extrapolated bandgap voltage at 0ºK

V

1.206

Vo

Carrier mobility knee voltage

V

10.

Tre1

Re linear temperature coefficient

1/ºC

0.

Tre2

Re quadratic temperature coefficient

1/ºC²

0.

Trb1

Rb linear temperature coefficient

1/ºC

0.

Trb2

Rb quadratic temperature coefficient

1/ºC²

0.

Trc1

Rc linear temperature coefficient

1/ºC

0.

Trc2

Rc quadratic temperature coefficient

1/ºC²

0.

Trm1

Rmb linear temperature coefficient

1/ºC

0.

Trm2

Rmb quadratic temperature coefficient

1/ºC²

0.

Iss

Substrate junction saturation current

A

0.

Ns

Substrate junction emission Coefficient

-

1.

 

The model parameter "level" can be used to specify another type of BJT in LTspice. Due to a generous contribution of source code from Dr.-Ing. Dietmar Warning of DAnalyse GmbH, Berlin, Germany; LTspice includes a version of VBIC. Set

Level=9 to use the alternate device. Level 4 is a synonym for level 9. The following documentation has been supplied by Dr. Warning:

 

VBIC - Vertical Bipolar Inter Company model

 

The VBIC model is a extended development of the Standard Gummel-Poon (SGP) model with the focus of integrated bipolar transistors in today's modern semiconductor technologies. With the implemented modified Quasi-Saturation model from Kull and Nagel it is also possible to model the special output characteristic of switching transistors. It is a widely used alternative to the SGP model for silicon, SiGe and III-V HBT devices.

 

VBIC Capabilities compared to Standard Gummel-Poon Model

 

o Integrated Substrate transistor for parasitic devices in integrated processes

o Weak avalanche and Base-emitter breakdown model

o Improved Early Effect modeling

o Physical separation of Ic and Ib

o Improved Depletion capacitance model

o Improved temperature modeling

o Self-heating modeling (not in this version)

 

Model Structure

 

image\vbic.gif

 

Parameters

Because the VBIC model is based on SGP model it is possible to start with SGP parameters, carry out some transformations. Following parameters are from VBIC version 1.2, which is implemented in LTSpice in the 4-terminal version without excess phase network and self-heating effect. To switch from SGP to VBIC you should set the extra parameter level to 9.

 

Name

Parameter meaning

Unit

Default

tnom

Parameter measurement temperature

ºC

27.

rcx

Extrinsic coll resistance

W

0.1

rci

Intrinsic coll resistance

W

0.1

vo

Epi drift saturation voltage

V

Infin.

gamm

Epi doping parameter

 

0.0

hrcf

High current RC factor

 

Infin.

rbx

Extrinsic base resistance

W

0.1

rbi

Intrinsic base resistance

W

0.1

re

Intrinsic emitter resistance

W

0.1

rs

Intrinsic substrate resistance

W

0.1

rbp

Parasitic base resistance

W

0.1

is

Transport saturation current

A

1e-16

nf

Forward emission coefficient

 

1.

nr

Reverse emission coefficient

 

1.

fc

Fwd bias depletion capacitance limit

 

0.9

cbeo

Extrinsic B-E overlap capacitance

F

0.0

cje

Zero bias B-E depletion capacitance

F

0.0

pe

B-E built in potential

V

0.75

me

B-E junction grading coefficient

 

0.33

aje

B-E capacitance smoothing factor

 

-0.5

cbco

Extrinsic B-C overlap capacitance

F

0.

cjc

Zero bias B-C depletion capacitance

F

0.

qco

Epi charge parameter

C

0.

cjep

B-C extrinsic zero bias capacitance

F

0.

pc

B-C built in potential

V

0.75

mc

B-C junction grading coefficient

 

0.33

ajc

B-C capacitance smoothing factor

 

-0.5

cjcp

Zero bias S-C capacitance

F

0.

ps

S-C junction built in potential

V

0.75

ms

S-C junction grading coefficient

 

0.33

ajs

S-C capacitance smoothing factor

 

-0.5

ibei

Ideal B-E saturation current

A

1e-18

wbe

Portion of IBEI from Vbei 1-WBE from Vbex

 

1.

nei

Ideal B-E emission coefficient

 

1.

iben

Non-ideal B-E saturation current

A

0.

nen

Non-ideal B-E emission coefficient

 

2.

ibci

Ideal B-C saturation current

A

1e-16

nci

Ideal B-C emission coefficient

 

1.

ibcn

Non-ideal B-C saturation current

A

0.

ncn

Non-ideal B-C emission coefficient

 

1.

avc1

B-C weak avalanche parameter 1

1/V

0.

avc2

B-C weak avalanche parameter 2

1/V

0.

isp

Parasitic transport saturation current

A

0.

wsp

Portion of ICCP

 

1.

nfp

Parasitic fwd emission coefficient

 

1.

ibeip

Ideal parasitic B-E saturation current

A

0.

ibenp

Non-ideal parasitic B-E saturation current

A

0.

ibcip

Ideal parasitic B-C saturation current

A

0.

ncip

Ideal parasitic B-C emission coefficient

 

1.

ibcnp

Non-ideal parasitic B-C saturation current

A

0.

ncnp

Non-ideal parasitic B-C emission coefficient

 

2.

vef

Forward Early voltage

 

Infin.

ver

Reverse Early voltage

 

Infin.

ikf

Forward knee current

A

Infin.

ikr

Reverse knee current

A

Infin.

ikp

Parasitic knee current

A

Infin.

tf

Ideal forward transit time

s

0.

qtf

Variation of TF with base-width modulation

 

0.

xtf

Coefficient for bias dependence of TF

 

0.

vtf

Voltage giving VBC dependence of TF

V

Infin.

itf

High current dependence of TF

A

Infin.

tr

Ideal reverse transit time

sec

0.

td

Forward excess-phase delay time

Sec

0.

kfn

B-E Flicker Noise Coefficient

 

0.

afn

B-E Flicker Noise Exponent

 

1.

bfn

B-E Flicker Noise 1/f dependence

 

1.0

xre

Temperature exponent of RE

 

0.

xrbi

Temperature exponent of RBI

 

0.

xrci

Temperature exponent of RCI

 

0.

xrs

Temperature exponent of RS

 

0.

xvo

Temperature exponent of VO

 

0.

ea

Activation energy for IS

V

1.12

eaie

Activation energy for IBEI

V

1.12

eaic

Activation energy for IBCI/IBEIP

V

1.12

eais

Activation energy for IBCIP

V

1.12

eane

Activation energy for IBEN

V

1.12

eanc

Activation energy for IBCN/IBENP

V

1.12

eans

Activation energy for IBCNP

V

1.12

xis

Temperature exponent of IS

 

3.

xii

Temperature exponent of IBEI,IBCI,IBEIP,IBCIP

 

3.

xin

Temperature exponent of IBEN,IBCN,IBENP,IBCNP

 

3.

tnf

Temperature exponent of NF

 

0.

tavc

Temperature exponent of AVC2

 

0.

rth

Thermal resistance

K/W

0.

cth

Thermal capacitance

Ws/K

0.

vrt

Punch-through voltage of internal B-C junction

V

0.

art

Smoothing parameter for reach-through

 

0.1

ccso

Fixed C-S capacitance

F

0.

qbm

Select SGP qb formulation

 

0.

nkf

High current beta rolloff

 

0.5

xikf

Temperature exponent of IKF

 

0.

xrcx

Temperature exponent of RCX

 

0.

xrbx

Temperature exponent of RBX

 

0.

xrbp

Temperature exponent of RBP

 

0.

isrr

Separate IS for fwd and rev

 

1.

xisr

Temperature exponent of ISR

 

0.

dear

Delta activation energy for ISRR

 

0.

eap

Excitation energy for ISP

 

1.12

vbbe

B-E breakdown voltage

V

0.

nbbe

B-E breakdown emission coefficient

 

1.

ibbe

B-E breakdown current

 

1e-06

tvbbe1

Linear temperature coefficient of VBBE

 

0.

tvbbe2

Quadratic temperature coefficient of VBBE

 

0.

tnbbe

Temperature coefficient of NBBE

 

0.

ebbe

exp(-VBBE/(NBBE*Vtv))

 

0.

dtemp

Locale Temperature difference

º

0.

vers

Revision Version

 

1.2

vref

Reference Version

 

0.

 

References:

C. C. McAndrew et al., "Vertical Bipolar Inter Company 1995: An Improved Vertical, IC Bipolar Transistor Model", Proceedings of the IEEE Bipolar Circuits and Technology Meeting, pp. 170 − 177, 1995

 

C. C. McAndrew et.al., VBIC95, "The Vertical Bipolar Inter-Company Model", IEEE Journal of Solid State Circuits, vol. 31, No. 10, October 1996

 

C. C. McAndrew, VBIC Model Definition, Release 1.2, 18. Sep. 1999