PhD in 1989 for my work about thick film sensors and their analysis. HDR certificate in 1999. Professor since 2001.
Works: Further projects based on the use of physical failure to investigate the reliability of the electronic components and electronic systems, development of tools for non-destructive analysis for micro assemblies and passive components. These tools are based on the use of acoustic microscopy (one made by our self and one purchase @ MB electronics PVA TPLA) and the development of signal processing used to help with the interpretation of acoustic images obtained. Tools are also developed from the use of impedance spectroscopy to study the reliability of passive components: capacitors, resistors, quartz ... (www.researchgate.net/profile/Y_Ousten)
Elected to the executive committee of IMAPS France. Board at French chapter IEEE CPMT
Participation on Master 3D - 1 FUI Novaplast - EURIPIDES program EDDEMA and RAPID program HYPERCOMPACT
The lessons main themes are : assembly technologies (Hybrid, CMS, modes of report), passive components (Discrete and embedded), the C language (introduction and drive of an electric vehicle through parallel port), Tools for Quality (Design of Experiments, FMEA), technical survey (methodology).
In charge since january 2018 of the WAVES Group at IMS
Specialties: RELIABILITY QUALITY EDUCATION FMEA - DOE - Passive components - Component degradation laws - C language - Purchasing and innovation